The Product Engineering Team Provides Value Add By Defining, elaborating, approving and/or ensuring implementation of specifications and requirements, for the product assigned.
Elaborating or allocating functional budgets and resources, and agreeing with stakeholder in business.
Managing the product development project, coordinating roll-out of project plan and managing the achievement of the plan.
Coordinating the related engineering disciplines (e.g., new platforms, IC layouts, mechanics, electronics).
Integrating and managing idea generation, product design, simulation & testing, and other specific engineering activities.
Cooperating with Manufacturing Product Integration (MPI) to continuously increase the yield and functioning of the product.
Responsible for contributing to the success of Vishay through working together with the Engineering and Production team members to develop advanced processes and solutions for the power devices.
Work with a talented team of engineers responsible for the design, development and qualification of semiconductor SiC wafer fabrication processes.
Duties And Responsibilities Will Include The Following Develop new wafer process modules with focus on Films deposition for SiC wafers.
Execute major process development and/or integration tasks and build up products.
Maintain, and improve process modules including design rules, structural and electrical specifications.
Design critical experiments and analyze data.
Assist in the transfer of a new technology from R&D to manufacturing ramp and qualification.
Effective communication to Sustaining Process engineering, shift personnel and other groups as required.
Work with Sustaining Process engineering team to ensure correct documentation is in place, i.e.
operating specifications, FMEA's, OCAP's etc.
Work with Sustaining Process engineering team to ensure appropriate and robust process control checks, in-line product measurement and process control charts are in place to sustain process robustness.
Ensure M.I.S (Promis) process flows are correct through each owned equipment set.
Qualifications And Education Requirements Degree/HND in Scientific/Engineering discipline is preferred.
Desired Skills 3 years plus wafer fab experience.
Knowledge of semiconductor devices and industrial semiconductor technology.
Hands on experience in wafer fab process module developments on Films equipment.
Familiar with all modern manufacturing concepts such as JIT, Kaizen, Zero Defects, SPC, TQM and TPM.
Ability to work flexible hours.
Ability to communicate effectively, verbally, and written form through technical presentations and technical reports.
Teamwork approach.
Highly motivated, results orientated customer service orientated, strong leadership and communication skills.
Experience On Following Tools For Equipment Ideally some level and experience and understanding of Film process engineering experience, Applied Materials Endura PVD, SPTS FXP PVD and SPTS APM experience would be an advantage.
Physical Demands Employee will be frequently required to stand, walk, sit, use hands to finger, handle or feel objects, tools, or controls, reach with hands and arms, and stoop kneel or crouch.
The employee must occasionally lift and/or move up to 10 pounds.
Typing and Computer work with the ability to lift or move approximately 10 pounds.
The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job.
Why work for us?
Salary based on skills and experience Funded training and development at all levels (up to masters level) Annual bonus scheme Medical cover options available Competitive 'Smart' pension contribution Life assurance of 4x salary Free Employee assistance programme On site fitness centre Sports and social clubs Retail, sports and entertainment reductions On site restaurant and outdoor gardens Free on site parking Career development opportunities