Electronics PCB Engineer - High Speed / Chip Packaging Are you a senior PCB engineer with experience in Chip Packaging looking for the next step in your career?
Want to join a world renowned, exciting, and dynamic Semiconductor company?
We are partnered with a globally recognised semiconductor company and they are looking for a Electronics PCB Engineer to join the team in Cambridge on a permanent basis.
The role offers hybrid working and will offer excellent career progression, a solid base salary (dependant on experience) plus stocks.
All whilst working in a dynamic, multicultural and inclusive team.
Sound good?
What we look for is: High speed design experience with extensive knowledge in PCB stack-ups and topologies Experience in working alongside a chip packaging team .
Able to influence and advise on the pinout of SoC's based on PCB analysis efforts including cost optimization, feasibility and trade-off analysis Experienced in escape routing analysis of high density SoC's and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set Detailed knowledge of Signal Integrity analysis of high and Power Integrity techniques from both board design and chip packaging perspectives Detailed knowledge of embedded system board design, designing with complex LSI devices such as FPGAs, demonstrating an understanding of various high speed IO interface standards such as PCIe and DDR Any of the following will be considered a plus: Experience in using Cadence CIS, Mentor PADs Layout, Allegro PCB design suite and Hyperlynx tools Experience of automating: decoupling capacitor optimization, DCR, SI, IC placement optimization etc Visa sponsorship can be facilitated so international applicants are welcomed.
If this sounds interesting and you'd like to learn more, click the link below to apply or email me with a copy of your CV on
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